TYPE | DESCRIPTION |
HTS | 8473.30.11.40 |
Module | DRAM Module |
Module Density | 64Gbyte |
Number of Chip per Module | 36 |
Chip Density (bit) | 16G |
Data Bus Width (bit) | 72 |
Max. Access Time (ns) | 0.165 |
Maximum Clock Rate (MHz) | 2933 |
Chip Configuration | 4Gx4 |
Chip Package Type | 78FBGA |
Minimum Operating Supply Voltage (V) | 1.14 |
Typical Operating Supply Voltage (V) | 1.2 |
Maximum Operating Supply Voltage (V) | 1.26 |
Supplier Temperature Grade | Extended |
Module Sides | Double |
ECC Support | Yes |
Number of Ranks | Quad |
Number of Chip Banks | 16 |
CAS Latency | 21 |
SPD EEPROM Support | No |
Standard Package Name | DIM |
Supplier Package | RDIMM |
Mounting | Socket |
Package Height | 31.25 |
Package Length | 133.35 |
Package Width | 4.3(Max) |
PCB changed | 288 |
Part Status | Active |
Pin Count | 288 |
Organization | 8Gx72 |
PLL | No |
Self Refresh | Yes |
Module Type | 288LRDIMM |